Customization: | Available |
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Material: | Copper |
Hydraulic Resistance: | 40kpa |
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PRODUCT SPECIFICATION FOR WATER COOLING PlATE | ||
NO. | ITEM DESCRIPTION | CONTENT |
1 | Product name | H100 Copper Liquid Cooling Plate for Data Center Server (8GPU Cards+4Nvlink Cards) |
2 | Material | Copper |
3 | Dimension | 906×331×139.6 mm |
4 | Cooling capacity | 700w*8;186w*4 |
5 | Surface Temprature | <65 centigrade |
6 | Flatness | 0.1 mm |
7 | Working Environment | 40 centigrade,10LPM, 20EGW |
8 | Joining Method | TLP welding |
9 | Manufacturing technique for inner passage | CNC machining, extrusion or other available technique |
10 | OEM & ODM | Available |
11 | Tolerance | ±0.01mm |
12 | Place of Origin | China |
13 | Packing way | To be packed in carton box or plywood case with films protection |